For data storage manufacturers

The key to increasing data storage is increased platter utilization via smaller and smaller read/write magnetic heads

However, shrinking heads drives process complexity and requires a greater emphasis on defect control.  Whether your application is inline defect characterization, pole-tip inspection, bondpad inspection, or outgoing final quality assurance; Rudolph Technologies NSX® series is uniquely positioned with advanced resolutions required to detect the defects of interest at a low cost of ownership.

NSX 220

Automated defect inspection for MEMS, LED and Semiconductors